Shenzhen Hengstar Technology Co., Ltd.

Shenzhen Hengstar Technology Co., Ltd.

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86-755-89992216

Shenzhen Hengstar Technology Co., Ltd.
HomeNgwaahịaIndullọ Ọrụ Nlekọta ModulDDR3 UDIMM

DDR3 UDIMM

Ụdị Ụgwọ:
L/C,T/T,D/A
Enweghi ike:
FOB,EXW,CIF
Min. Nhazi:
1 Piece/Pieces
Ụgbọ njem:
Ocean,Air,Express,Land
  • Nkọwapụta ngwaahịa
Overview
Njirimara Ngwaahịa

Ihe Nlereanya.NSO4GU3AB

Tụkwasịnụ Ikike & Ozi ndị ọz...

Ụgbọ njemOcean,Air,Express,Land

Ụdị ỤgwọL/C,T/T,D/A

Enweghi ikeFOB,EXW,CIF

Nkwakọ ngwaahịa & nzipu
Ere Ngwa:
Piece/Pieces

4GB 1600mhz 240-pin Ddr3 udimm


Ntughari Akụkọ

Revision No.

History

Draft Date

Remark

1.0

Initial Release

Apr. 2022

 

Inye Isiokwu Ozi

Model

Density

Speed

Organization

Component Composition

NS04GU3AB

4GB

1600MHz

512Mx64bit

DDR3 256Mx8 *16


Nkowa
HDEngStar Unbuffed Ddr3 SDRAM DOMS (Unguffed okpukpu abụọ data na-eme ka iche iche na-ebe nchekwa) bụ ike ebe nchekwa, modulu na-eme ngwa ngwa na-eji ngwaọrụ DDR3. NS04GU3AB bụ 512m X 60-bit abụọ 4GB RDR3-1600 CLDR3-1600 CLDRAM Ngwaahịa Dumm, dabere na usoro iri na isii x 8-bit fbga. A na-eme SPD na mpaghara Jedec Standard Ddr3-1600 oge nke 11-11-11 na 1.5v. Nke ọ bụla 240-pin Dinm na-eji mkpịsị aka ọla edo edo edo. Ebumnuche SDRMEFEDDEDEDEDEDEDEDEDE maka iji dị ka ebe nchekwa ma etinyere n'usoro dị ka PC na ọrụ.


EGO
IFPOWA: VDD = 1.5v (1.425v rue 1.575v)
vddq = 1.5v (1.425V ruo 1.575v)
800mhz Fck maka 1600MB / sec / pin
 bandlọ akụ nkeonwe
Passlọ ọrụ Canprogramimambible: 11, 10, 9, 8, 7, 6
Ana m atụ anya nkọ: 0, cl - 2, ma ọ bụ elekere - 1
8-bit pre-fatch
Нryburst Ogologo: 8 (na-enweghị oke ọ bụla, usoro ọ bụla na mbido "naanị) nke na-anaghị ekwe ka ọ na-agụ akwụkwọ ma ọ bụ na-eji A12 ma ọ bụ Mrs]
bi-nduzi data dị iche iche
Icental (onwe gi); Ihu onwe onye nke onwe ya site na ZQ PIN (RZQ: 240 Ohm ± 1%)
on nwụnahụ site na iji pint pin
eaverage Rueen na-eme ka Oge Nta 85 Celsius C, 3.9us na 85 Celsius C <95 Celsius C
chronous Reset
À na-eme ka data dị ike
ellly-site na Topology
PCB: ịdị elu 1.18 "(30mm)
rohs na-agba mbọ na halogen-Free


Isi usoro usoro

MT/s

tRCD(ns)

tRP(ns)

tRC(ns)

CL-tRCD-tRP

DDR3-1600

13.125

13.125

48.125

2011/11/11


Tebụl adresị

Configuration

Refresh count

Row address

Device bank address

Device configuration

Column Address

Module rank address

4GB

8K

32K A[14:0]

8 BA[2:0]

2Gb (256 Meg x 8)

1K A[9:0]

2 S#[1:0]


Nkọwa PIN

Symbol

Type

Description

Ax

Input

Address inputs: Provide the row address  for ACTIVE commands, and the column
address and auto precharge bit (A10) for READ/WRITE commands, to select one location
out of the memory array in the respective bank. A10 sampled during a PRECHARGE
command determines whether the PRECHARGE applies to one bank (A10 LOW, bank
selected by BAx) or all banks (A10 HIGH). The address inputs also provide the op-code
during a LOAD MODE command. See the Pin Assignments table for density-specific
addressing information.

BAx

Input

Bank address inputs: Define the device bank to which an ACTIVE, READ, WRITE, or
PRECHARGE command is being applied. BA define which mode register (MR0, MR1,
MR2, or MR3) is loaded during the LOAD MODE command.

CKx,
CKx#

Input

Clock: Differential clock inputs. All control, command, and address input signals are
sampled on the crossing of the positive edge of CK and the negative edge of CK#.

CKEx

Input

Clock enable: Enables (registered HIGH) and disables (registered LOW) internal circuitry
and clocks on the DRAM.

DMx

Input

Data mask (x8 devices only): DM is an input mask signal for write data. Input data is
masked when DM is sampled HIGH, along with that input data, during a write access.
Although DM pins are input-only, DM loading is designed to match that of the DQ and DQS pins.

ODTx

Input

On-die  termination:  Enables  (registered  HIGH)  and  disables  (registered  LOW)
termination resistance internal to the DDR3 SDRAM. When enabled in normal operation,
ODT is only applied to the following pins: DQ, DQS, DQS#, DM, and CB. The ODT input will be ignored if disabled via the LOAD MODE command.

Par_In

Input

Parity input: Parity bit for Ax, RAS#, CAS#, and WE#.

RAS#,
CAS#,
WE#

Input

Command inputs: RAS#, CAS#, and WE# (along with S#) define the command being
entered.

RESET#

Input
(LVCMOS)

Reset: RESET# is an active LOW asychronous input that is connected to each DRAM and
the registering clock driver. After RESET# goes HIGH, the DRAM must be reinitialized as
though a normal power-up was executed.

Sx#

Input

Chip select: Enables (registered LOW) and disables (registered HIGH) the command
decoder.

SAx

Input

Serial address inputs: Used to configure the temperature sensor/SPD EEPROM address
range on the I2C bus.

SCL

Input

Serial
communication to and from the temperature sensor/SPD EEPROM on the I2C bus.

CBx

I/O

Check bits: Used for system error detection and correction.

DQx

I/O

Data input/output: Bidirectional data bus.

DQSx,
DQSx#

I/O

Data strobe: Differential data strobes. Output with read data; edge-aligned with read data;
input with write data; center-alig

SDA

I/O

Serial
sensor/SPD EEPROM on the I2C bus.

TDQSx,
TDQSx#

Output

Redundant data strobe (x8 devices only): TDQS is enabled/disabled via the LOAD
MODE command to the extended mode register (EMR). When TDQS is enabled, DM is
disabled and TDQS and TDQS# provide termination resistance; otherwise, TDQS# are no
function.

Err_Out#

Output (open
drain)

Parity error output: Parity error found on the command and address bus.

EVENT#

Output (open
drain)

Temperature event: The EVENT# pin is asserted by the temperature sensor when critical
temperature thresholds have been exceeded.

VDD

Supply

Power supply: 1.35V (1.283–1.45V) backward-compatible to 1.5V (1.425–1.575V). The
component VDD and VDDQ are connected to the module VDD.

VDDSPD

Supply

Temperature sensor/SPD EEPROM power supply: 3.0–3.6V.

VREFCA

Supply

Reference voltage: Control, command, and address VDD/2.

VREFDQ

Supply

Reference voltage: DQ, DM VDD/2.

VSS

Supply

Ground.

VTT

Supply

Termination voltage: Used for control, command, and address VDD/2.

NC

No connect: These pins are not connected on the module.

NF

No function: These pins are connected within the module, but provide no functionality.

Ihe ndetu : tebụl Nkọwapụta PIN dị n'okpuru bụ ndepụta zuru oke nke eserese niile enwere ike ịnwere. Eserese niile edepụtara nwere ike A naghị akwado ya na modul a. Lee PIN ọrụ maka ozi akọwapụtara modulu a.


A na-arụ ọrụ na-egbochi achịcha

4GB, 512mx644 (2rnk nke x8)

1


2


Mara:
1. Bọọlụ ZQ na mpaghara DDR3 ọ bụla jikọtara ya na mpụga 240 site na mpụga 1% na-eguzogide nke e kegidere n'ala. A na-eji ya maka mmezi nke nkwụsị nke akụrụngwa na onye ọkwọ ụgbọ ala.



Modulu akụkụ


Ihu n'ihu

3

Ihu n'ihu

4

Ndetu:
1. Ogologo ya na milimita (sentimita); Max / min ma ọ bụ ụdị (ụdị) ebe ahụ.
2.nwe ogo ya na akụkụ niile dị mkpụmkpụ ± 0.15mm belụsọ ma akọwapụtara ya.
3. Eserese eserese bụ naanị maka.

Ngwaahịa : Indullọ Ọrụ Nlekọta Modul

Email na ngwaahịa a
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  • *Iji:
    Mr. Jummary
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    Ozi gị ga-adị n'etiti edemede 20-8000
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